The electronic packaging handbook
The electronic packaging handbook
复制标题
电子封装手册
DOI:
10.1201/9781420049848
复制
发表时间:
1999
期刊:
影响因子:
--
通讯作者:
G. Blackwell
中科院分区:
文献类型:
--
作者:
G. Blackwell
Fundamentals of the Design Process Surface Mount Technology Integrated Circuit Packages Direct Chip Attach Circuit Boards EMC and PCB Design Hybrid Assemblies Interconnects Design for Test Adhesive and Its Application Thermal Management Testing Inspection Package/Enclosure Electronics Package Reliability and Failure Analysis: A Micromechanics-Based Approach Product Safety and Third-Party Certification Appendix A: Definitions Index