Chemical Cracking Effect of Aqua Regia on the Purification of Metallurgical-Grade Silicon
Chemical Cracking Effect of Aqua Regia on the Purification of Metallurgical-Grade Silicon
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DOI：
10.1021/ie400051z
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发表时间：
2013-05
影响因子：
4.2
通讯作者：
Hu Zhang;Zhi Wang;Wenhui Ma;K. Xie;Lei Hu
中科院分区：
文献类型：
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作者：
Hu Zhang;Zhi Wang;Wenhui Ma;K. Xie;Lei Hu
研究了王水浸出过程中对冶金级硅(MG-Si)的化学破裂效应。结果表明，酸浸使硅粉的粒度减小，且随着硅粉粒度的增大，这一现象更加明显。裂纹的产生主要归因于主要杂质的溶解，而主要杂质的溶解取决于MG-Si中杂质相的组成和分布。此外，还研究了浸出过程中发生化学破裂效应时，主要金属杂质的去除效率。粗颗粒去除效果显著，除铁7.9%，铝77%，钙45%，铁63%。其原因可能是王水的强氧化促进了硅铝铁可溶相的溶解，从而提高了酸对杂质的去除效果。
The chemical cracking effect on metallurgical-grade silicon (MG-Si) during leaching by aqua regia was investigated. The results showed that the granularity of the particles was reduce by acid leaching, and the phenomenon was more noticeable with the increase in the silicon particle size. The cracking was essentially ascribed to the dissolution of the major impurities that depended on the composition and distribution of the impurity phases in MG-Si. In addition, the removal efficiency of the main metallic impurities with the occurrence of the chemical cracking effect during the leaching process was studied. The remarkable efficiency was obtained from the coarse particle size,where 7.9% Fe, 77% Al, 45% Ca, and 63% were removed. The reason could be attributed to the strong oxidation of aqua regia that promoted the dissolution Of the Si Al-Fe soluble phase, which resulted in the enhanced removal effect of acid on the impurities.