Investigation on Thermal Characterization of Eutectic Flip-Chip UV-LEDs With Different Bonding Voidage
Investigation on Thermal Characterization of Eutectic Flip-Chip UV-LEDs With Different Bonding Voidage
复制标题
不同键合空隙共晶倒装 UV-LED 的热特性研究
DOI：
10.1109/ted.2017.2656240
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发表时间：
2017
影响因子：
3.1
通讯作者：
Chen Changqing
中科院分区：
文献类型：
--
作者：
Liang Renli;Zhang Jun;Wang Shuai;Chen Qian;Xu Linlin;Dai Jiangnan;Chen Changqing
采用金锡共晶直接封装的倒装法制备的紫外发光二极管（FC UV-LED）具有良好的热性能和可靠性，是目前研究和开发的热点。然而，由于AuSn填充不足，共晶键合层中的空隙对FC UV-LED的热管理和光学性能有很大影响，并且认为共晶空隙会影响FC UV-LED的导热电阻（以下统一称为热阻）和结温。在本文中，建模和热模拟使用有限元分析开发考虑的几何模型的共晶FC紫外LED与3%，10%，20%，和30%的键合空隙率。同时，为了验证模拟结果，利用热瞬态测试仪对FC UV-LED的热参数进行了测试，发现在模拟和实验中，空隙率为3%的UV-LED的热阻和结温均低于其他样品。此外，通过光电分析系统评估的UV-LED的光学性能，结果证实，最低的热阻导致最低的结温，但最高的光输出功率。
Flip-chip ultraviolet light-emitting diode (FC UV-LED) fabricated by direct AuSn eutectic package is of high interest in Research and Development due to its excellent thermal performance and good reliability. However, the voids in eutectic bonding layer due to the lack of AuSn filled have a big influence on the thermal management and optical performance of FC UV-LEDs, and it is believed that the eutectic voids can affect the thermal-conduction resistance (the following unified called thermal resistance) and the junction temperature of FC UV-LEDs. In this paper, modeling and thermal simulation using finite element analysis is developed by considering the geometrical model of eutectic FC UV-LEDs with 3%, 10%, 20%, and 30% bonding voidage. Meanwhile, to validate the simulation, the thermal parameters of FC UV-LEDs are determined and measured using thermal transient tester, and it is found that UV-LED with 3% voidage shows lowest thermal resistance and junction temperature compared with the other samples in both simulation and experiment. Moreover, the optical performance of UV-LEDs is evaluated via the photoelectric analysis system, and the results confirm that the lowest thermal resistance leads to the lowest junction temperature but the highest light output power.