Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA
Fabrications of Micro-Channel Device by Hot Emboss and Direct Bonding of PMMA
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PMMA热压印和直接键合制备微通道器件
DOI：
10.1109/icmens.2004.66
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
Y. Wada
中科院分区：
文献类型：
--
作者：
J. Mizuno;T. Harada;T. Glinsner;M. Ishizuka;T. Edura;K. Tsutsui;H. Ishida;S. Shoji;Y. Wada
我们制作了一个宽50μm、深30μm的微通道器件，并对该器件的机械、光学和流体特性进行了评价。对所制造的微通道器件进行了结合强度评估，证实其对于实际使用以及对于相当苛刻的清洁条件（如在纯水中的超声清洁）来说足够高。还评估了粘合界面周围的光学损耗，没有观察到光吸收的增加。上述结果证实了使用PMMA板的用于微通道制造的热固化和直接键合技术实现了高性能的微通道器件。
We have fabricated and evaluated the mechanical, optical and fluidic characteristics a 50µm wide and a 30µm deep micro-channel device produced by hot emboss and direct bonding of PMMA plate with dimensions of 20mm × 20mm × 1mm. The fabricated micro-channel device was evaluated the bond strength, which was confirmed to be high enough for practical use as well as for quite severe cleaning conditions as ultrasonic cleaning in pure water. The optical loss around bonded interface was also evaluated and no increase in the light absorption was observed. The above results confirmed that the hot emboss and direct bonding technologies for micro-channel manufacturing using the PMMA plates realizes high performance micro channel devices.