Advances in Electronic Interconnection Materials
Advances in Electronic Interconnection Materials
复制标题
电子互连材料的进展
DOI：
10.1007/s11837-018-3267-4
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发表时间：
2018
期刊：
影响因子：
2.6
通讯作者：
Gourlay C
中科院分区：
文献类型：
--
作者：
Gourlay C
虽然大多数电子领域向无铅焊料的过渡几乎已经完成，但下一代电子产品的持续可靠性要求带来了重大的新挑战，并引发了全球范围内的深入研究。这是由以下趋势驱动的，包括：（1）消费电子产品的持续小型化和3D集成，以提高性能（2）在更恶劣的环境条件下操作接头，这可以例如使电子部件单元（ECU）能够移动得更靠近发动机，从而减少布线，并因此减少质量;（3）由于从安全监控到电气和自动驾驶等应用中对传感器的依赖增加，导致向更高可靠性的电子产品发展;以及（4）需要可靠的低温焊料合金，该低温焊料合金具有经济和环境效益，并且可以减少薄，提高电子互连的可靠性的许多挑战是材料挑战。例如，需要新的互连材料在更高的温度下安全操作，在更大的温度范围内循环，同时承受更高的电流密度、更陡的温度梯度和冲击载荷。这些可能包括新的焊料合金、烧结膏和导电粘合剂，而这又可能需要新的优化基板、表面处理和焊剂。与此同时，新的制造工艺，如新的沉积方法，瞬时液相键合方法，和直接铜-铜键合，正在探索和实施。与此同时，为了提高在役可靠性和接头寿命的预测，
While the transition to Pb-free solder materials is almost complete for most electronic segments, the ongoing reliability requirements of next-generation electronics have introduced significant new challenges and triggered intensive global research. This is being driven by trends including:(1) the ongoing miniaturization and 3D integration of consumer electronics for improved performance (eg, processor speeds and bandwidth) which leads to higher current densities and steeper temperature gradients across fine pitch joints;(2) the operation of joints in harsher environmental conditions, which can, for example, enable electronic component units (ECUs) to be moved closer to the engine, reducing wiring and, therefore, mass;(3) the move towards higher reliability electronics caused by the increased reliance on sensors in applications from security monitoring to electrical and autonomous driving; and (4) the need for reliable, low-temperature solder alloys that have economic and environmental benefits and can reduce the dynamic warpage that is necessary for the assembly of thin, flexible electronics.Many of the challenges for the improved reliability of electronic interconnections are materials challenges. For example, new interconnection materials are required for safe operation at higher temperature, cycling through larger temperature ranges whilst enduring higher current densities, steeper temperature gradients and impact loading. These may include new solder alloys, sintering pastes, and conductive adhesives, which in turn may require new, optimized substrates, surface finishes and fluxes. At the same time, new manufacturing processes, such as new deposition methods, transient liquid phase bonding approaches, and direct Cu-Cu bonding, are being explored and implemented. In parallel, to improve the prediction of in-service reliability and joint lifetime,