A promising structure for fabricating high strength and high electrical conductivity copper alloys.
A promising structure for fabricating high strength and high electrical conductivity copper alloys.
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一种用于制造高强度和高导电率铜合金的有前景的结构。
DOI：
10.1038/srep20799
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发表时间：
2016-02-09
影响因子：
4.6
通讯作者：
Wang T
中科院分区：
文献类型：
--
作者：
Li R;Kang H;Chen Z;Fan G;Zou C;Wang W;Zhang S;Lu Y;Jie J;Cao Z;Li T;Wang T
为了解决强度和导电性之间的权衡，我们提出了一种策略：将沉淀颗粒引入由变形孪晶组成的结构中。设计了Cu-0.3%Zr合金来验证我们的策略。锆在冷滚前通过固溶处理溶解到铜基体中，在随后的时效处理中以Cu5Zr形式从铜基体中析出。通过透射电子显微镜和x射线衍射分析研究了加工样品的微观组织演变，并通过拉伸和电导率测试评估了加工样品的力学和物理行为。结果表明，该材料具有优异的抗拉强度（602.04 MPa）和电导率（81.4% IACS）。该策略为平衡铜合金的强度和导电性提供了一条新的途径，可以发展为大规模的工业应用。
To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu5Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application.