Processing, microstructure, and properties of ternary high-strength Cu–Cr–Ag in situ composites

Processing, microstructure, and properties of ternary high-strength Cu–Cr–Ag in situ composites
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DOI:
10.1016/s0921-5093(00)00981-3
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发表时间:
2000-10
影响因子:
6.4
通讯作者:
D. Raabe;K. Miyake;H. Takahara
D. Raabe;K. Miyake;H. Takahara
中科院分区:
材料科学1区
文献类型:
--
作者:
D. Raabe;K. Miyake;H. Takahara

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介绍了一种由Cu、Cr、Ag大变形量复合而成的新型高强度、高导电性三元原位金属基复合材料。本文详细研究了三种合金,即Cu-10 wt.% Cr-3wt.% Ag、Cu-10wt.% Cr-1wt.% Ag和Cu-4.5wt.% Cr-3wt.% AG.合金采用感应熔炼和激冷铸造工艺生产。由于Cu-Cr和Cu-Cr-Ag合金与超奥氏体Cr含量的延展性低于先前研究的Cu-Nb、Cu-Ag和Cu-Nb-Ag合金,因此特别注意使用热和热机械加工方案在强度和延展性方面优化微观结构。这些措施包括各种组合的模锻,重型线材变形(使用不同的润滑剂),固溶退火在不同的温度下淬火,并在不同的温度下老化。优化的工艺允许获得η=8.48(η=ln(A0/A),A:线材横截面)的最大线材应变。线材具有非常高的强度(例如Cu-10 wt.% Cr-3wt.% Ag:1260 MPa,应变η=8.48)和良好的导电性(固溶处理后,在应变η=2.5时,纯Cu(IACS)的导电性的62%)。当应变达到η ≥ 8.5时,强度与Cu-20 wt.% NB.丝强度远高于混合物的线性规则预测。调查提出了在各种热机械处理过程中的微观结构的演变,并与所观察到的机械和电气性能的结果。根据Hall-Petch型硬化讨论了强度。
A new class of ternary in situ metal matrix composites (MMCs) with high strength and high electrical conductivity consisting of heavily co-deformed Cu, Cr, and Ag is introduced. Three alloys are investigated in detail, namely, Cu–10wt.%Cr–3wt.%Ag, Cu–10wt.%Cr–1wt.%Ag, and Cu–4.5wt.%Cr–3wt.%Ag. The alloys were produced by inductive melting and chill casting. Because Cu–Cr and Cu–Cr–Ag alloys with hypereutectic Cr content are less ductile than previously investigated Cu–Nb, Cu–Ag, and Cu–Nb–Ag alloys, special attention was placed on optimizing microstructure with respect to both strength and ductility using thermal and thermo-mechanical processing schemes. These included various combinations of swaging, heavy wire deformation (using different lubricants), solution annealing at different temperatures followed by quenching, and aging at different temperatures. Optimized processing allows one to attain maximum wire strains of η=8.48 (η=ln(A0/A), A: wire cross-section). The wires have very high strength (for instance Cu–10wt.%Cr–3wt.%Ag: 1260 MPa at a strain of η=8.48) and good electrical conductivity (62% of the conductivity of pure Cu (IACS) at a strain of η=2.5 after solution treatment). Up to wire strains of η≈8.5 the strength is equal to that of Cu–20wt.%Nb. The wire strength is much higher than predicted by the linear rule of mixtures. The investigation presents the evolution of microstructure during the various thermo-mechanical treatments and relates the results to the observed mechanical and electrical properties. The strength is discussed in terms of Hall–Petch-type hardening.