3-D thermal simulation of power module packaging
3-D thermal simulation of power module packaging
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DOI：
10.1109/ecce.2009.5316235
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发表时间：
2009-09
期刊：
影响因子：
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通讯作者：
I. Swan;A. Bryant;N. Parker-Allotey;P. Mawby
中科院分区：
文献类型：
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作者：
I. Swan;A. Bryant;N. Parker-Allotey;P. Mawby
本文介绍了在电热变换器仿真中，为快速、准确地对功率器件模块进行热仿真而开发和实现的解析式三维热模型。采用基于傅里叶的解法求解三维热方程。该解可以描述整个IPM结构的温度随时间的变化。该模型可以模拟由多个热源引起的热相互作用。与有限元（FEM）方法相比，热模型的模拟速度非常快。在MATLAB/Simulink中实现了新模型，以便与相同形式的转换器模型进行协同仿真。该模型与CFD软件包FLOTHERM进行了验证，结果吻合较好。基于傅里叶的模型成功地捕获了三维热扩散所需的方面。
This paper describes the development and implementation of an analytical 3-D thermal model for fast and accurate thermal simulation of power device modules in electro-thermal converter simulation. A Fourier-based solution is used to solve the 3-D heat equation. The solution can describe the variation of temperature through the whole IPM structure with time. The model can simulate thermal interactions resulting from multiple heat sources. The thermal model is extremely fast to simulate compared to finite-element (FEM) approaches. The new model has been implemented in MATLAB/Simulink in order to co-simulate with the converter model which is in the same form. The model has been validated against the CFD software package FLOTHERM and shows good agreement. The required aspects of 3-D heat diffusion are captured successfully by the Fourier-based model.