Ink-jet printed nanoparticle microelectromechanical systems
Ink-jet printed nanoparticle microelectromechanical systems
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DOI：
10.1109/84.982863
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发表时间：
2002-02-01
影响因子：
2.7
通讯作者：
Jacobson, JM
中科院分区：
文献类型：
--
作者：
Fuller, SB;Wilhelm, EJ;Jacobson, JM
我们报告了一种通过喷墨打印纳米粒子金属胶体增材构建三维（3-D）微机电系统（MEMS）和电路的方法。用纳米颗粒制造金属结构可以避免标准光刻制造和熔融金属液滴沉积所需的极端加工条件。纳米颗粒的直径通常为 1 至 100 纳米，可以在低至 300 摄氏度的塑料兼容温度下烧结，形成与块状材料几乎无法区分的材料。安装在计算机控制的 3 轴龙门架上的多个喷墨打印头将按重量计 10% 的金属胶体墨水逐层沉积到加热的基材上，形成二维 (2-D) 和 3-D 结构。我们报告了高 Q 谐振感应线圈、线性和旋转静电驱动电机以及平面和垂直电热执行器。这些器件可在几分钟内打印出 100 微米的特征尺寸，由具有高导电性的银和金材料制成，具有多达 400 层、绝缘体、10:1 垂直纵横比和蚀刻释放机械结构。这些结果提出了一种桌面或大面积 MEMS 制造系统的路线，该系统的特点是多层、低成本和数据驱动制造，可实现快速周转时间，并且代表了喷墨打印首次用于构建有源 MEMS。
We report a method to additively build three-dimensional (3-D) microelectromechanical systems (MEMS) and electrical circuitry by ink-jet printing nanoparticle metal colloids. Fabricating metallic structures from nanoparticles avoids the extreme processing conditions required for standard lithographic fabrication and molten-metal-droplet deposition. Nanoparticles typically measure I to 100 nm in diameter and can be sintered at plastic-compatible temperatures as low as 300 degreesC to form material nearly indistinguishable from the bulk material. Multiple ink-jet print heads mounted to a computer-controlled 3-axis gantry deposit the 10% by weight metal colloid ink layer-by-layer onto a heated substrate to make two-dimensional (2-D) and 3-D structures. We report a high-Q resonant inductive coil, linear and rotary electrostatic-drive motors, and in-plane and vertical electrothermal actuators. The devices, printed in minutes with a 100 mum feature size, were made out of silver and gold material with high conductivity,and feature as many as 400 layers, insulators, 10 : 1 vertical aspect ratios, and etch-released mechanical structure. These results suggest a route to a desktop or large-area MEMS fabrication system characterized by many layers, low cost, and data-driven fabrication for rapid turn-around time, and represent the first use of ink-jet printing to build active MEMS.