Broadband Single-Mode Hollow Substrate Integrated Waveguide with Photonic Crystal Sidewalls for Multilayer System-in-Package Applications
Broadband Single-Mode Hollow Substrate Integrated Waveguide with Photonic Crystal Sidewalls for Multilayer System-in-Package Applications
复制标题
用于多层系统级封装应用的具有光子晶体侧壁的宽带单模空心基板集成波导
DOI：
10.1109/ri2c51727.2021.9559789
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发表时间：
2021
期刊：
影响因子：
--
通讯作者：
Hong B
中科院分区：
文献类型：
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作者：
Hong B
我们用一维光子晶体代替金属通孔作为侧壁，从数值和实验上证明了一种宽带单模空心基板集成波导。通过避免垂直的金属壁，可以很容易地在夹在两个平行的金属板之间的单个平面衬底上将该波导制作成光子晶体结构。这种混合平板波导可以将毫米波和太赫兹波紧密地限制在低损耗的空芯中。在光子晶体侧壁的帮助下，基于所谓的模式过滤效应，波导中的高阶竞争模基本上被抑制，从而允许波导在倍频程带宽上以单HE01模的模式工作。根据我们的数值模拟，得益于使用较少的金属壁，所提出的混合波导在毫米波和太赫兹频率下的传输损耗可以小于经典的金属矩形中空波导。给出了一个工作在20~45 GHz的概念验证实验演示，验证了所提出的波导的特性和优点。这项工作为毫米波和太赫兹多层系统在封装应用中的倍频程带宽单模传输线提供了一个有前途的候选方案。
We numerically and experimentally demonstrate a broadband single-mode hollow substrate integrated waveguide using one-dimensional photonic crystal as sidewalls in place of metallic via holes. By avoiding the vertical metallic walls, the waveguide can be easily fabricated as a photonic crystal structure on a single planar substrate sandwiched between two parallel metal plates. Such a hybrid flat waveguide can tightly confine the millimeter and terahertz waves in the low-loss air core. With the aid of the photonic crystal sidewalls, high-order competing modes in the waveguide are substantially suppressed based on the so-called modal-filtering effect, allowing the waveguide to be operated in a single-HE01-mode pattern over an octave bandwidth. Benefiting from the less use of metallic walls, the propagation loss of the proposed hybrid waveguide can be less than that of the classic hollow metallic rectangular waveguide at millimeter-wave and terahertz frequencies according to our numerical simulation. A proof-of-concept experimental demonstration operating between 20 to 45 GHz is presented verifying the properties and the advantages of the proposed waveguide. This works offers a promising candidate for an octave-bandwidth single-mode transmission line for millimeter-wave and THz multilayer system-in-package applications.