Microstructure and Mechanical Properties of Nanostructured Co-Cu Alloy Films Processed by Electrodeposition
Microstructure and Mechanical Properties of Nanostructured Co-Cu Alloy Films Processed by Electrodeposition
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DOI：
10.1088/1742-6596/417/1/012064
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发表时间：
2013-03
期刊：
影响因子：
--
通讯作者：
M. Yuasa;H. Nakano;M. Mabuchi
中科院分区：
文献类型：
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作者：
M. Yuasa;H. Nakano;M. Mabuchi
采用电沉积法制备了两种纳米结构Co-Cu合金薄膜：纳米层状Co-Cu合金薄膜和超细晶两相Co-Cu合金薄膜，并研究了它们的微观结构和力学性能。这些纳米结构的Co-Cu合金薄膜表现出高硬度和低活化体积。纳米结构Co-Cu合金薄膜的机械性能很大程度上取决于晶界特征。在两相 Co-Cu 合金薄膜中进行分子动力学模拟，以研究 Co/Cu 界面处的位错发射。分子动力学模拟表明，Co/Cu界面处强烈的几何应变产生的堆垛层错在位错发射中起着重要作用。
Two kinds of nanostructured Co-Cu alloy films: a nanolamellar Co-Cu alloy film and an ultrafine-grained two-phase Co-Cu alloy film were processed by electrodeposition, and their microstructures and mechanical properties were investigated. These nanostructured Co-Cu alloy films showed the high hardness and the low activation volume. The mechanical properties of the nanostructured Co-Cu alloy films strongly depended on the grain boundary characteristics. Molecular dynamics simulations were performed in the two-phase Co-Cu alloy film to investigate the dislocation emission at the Co/Cu interface. The molecular dynamics simulations showed that the stacking faults, which are generated by the intense geometrical strain at the Co/Cu interface, play an important role in the dislocation emission.