The application of thick-film technology in C-MEMS
The application of thick-film technology in C-MEMS
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DOI:
10.1007/s10832-007-9064-z
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发表时间:
2007-12-01
影响因子:
1.7
通讯作者:
Pavlin, Marko
中科院分区:
文献类型:
--
作者:
Belavic, Darko;Hrovat, Marko;Pavlin, Marko
Laminated 3D structures made using low-temperature co-fired ceramic (LTCC) technology are practical for ceramic micro-electro-mechanical systems (C-MEMS). The sensors for mechanical quantities, and/or actuators, are fundamental parts of MEMS. Thick-film resistors can be used to sense the mechanical deformations, and thick-film piezoelectric materials can be used as electro-mechanical transducers in a C-MEMS structure. The integration of these thick-film materials on LTCC substrates is in some cases difficult to realise due to interactions with the rather glassy LTCC substrates. The subject of our work is an investigation of thick-film materials for electro-mechanical transducers (sensors and actuators) and their compatibility with LTCC substrates. Resistors made with commercial thick-film resistor materials for use as sensors on LTCC substrates have been investigated and evaluated. Ferroelectric ceramic materials based on solid solutions of lead zirconate titanate (PZT) with low firing temperatures around 850 degrees C were developed for thick-film technology and evaluated on LTCC substrates.