Bonding of universal adhesives to dentine - Old wine in new bottles?
Bonding of universal adhesives to dentine - Old wine in new bottles?
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DOI：
10.1016/j.jdent.2015.03.004
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发表时间：
2015-05-01
影响因子：
4.4
通讯作者：
Tay, F. R.
中科院分区：
文献类型：
--
作者：
Chen, C.;Niu, L. -N.;Tay, F. R.
目的：多模式通用粘合剂为临床医生提供使用蚀刻和冲洗技术、选择性牙釉质蚀刻技术或自蚀刻技术粘合到牙齿基底的选择。本研究检查了与人类冠状牙本质粘合的五种通用粘合剂的短期体外性能。方法：根据通用粘合剂的类型（Prime＆Bond Elect、Scotchbond Universal、All-Bond Universal、Clearfil Universal Bond 和 Futurabond U）将 200 个非龋齿人类第三磨牙分为 5 组。每个粘合剂组采用两种粘合模式（蚀刻和冲洗和自蚀刻）。粘合样品在测试前在去离子水中保存 24 小时或进行 10,000 次热循环老化过程 (N = 10)。进行了微拉伸粘合测试 (mu TBS)、非热循环标本中树脂-牙本质界面的透射电子显微镜 (TEM) 以及热循环标本混合层内注入示踪剂的富水区域的扫描电子显微镜 (SEM)。结果：粘合剂类型和测试条件（有/没有热循环）对 mu 有显着影响。 TBS。在蚀刻和冲洗或自蚀刻应用模式中使用每种粘合剂都不会导致与牙本质显着不同的 mu TBS。这些粘合剂在蚀刻-冲洗粘合模式和自蚀刻粘合模式下创建的混合层类似于 5 μm 和
Objective: Multi-mode universal adhesives offer clinicians the choice of using the etch-and-rinse technique, selective enamel etch technique or self-etch technique to bond to tooth substrates. The present study examined the short-term in vitro performance of five universal adhesives bonded to human coronal dentine.Methods: Two hundred non-carious human third molars were assigned to five groups based on the type of the universal adhesives (Prime&Bond Elect, Scotchbond Universal, All-Bond Universal, Clearfil Universal Bond and Futurabond U). Two bonding modes (etch-and-rinse and self-etch) were employed for each adhesive group. Bonded specimens were stored in deionized water for 24 h or underwent a 10,000-cycle thermocycling ageing process prior to testing (N = 10). Microtensile bond testing (mu TBS), transmission electron microscopy (TEM) of resin-dentine interfaces in non-thermocycled specimens and scanning electron microscopy (SEM) of tracer-infused water-rich zones within hybrid layers of thermocycled specimens were performed.Results: Both adhesive type and testing condition (with/without thermocycling) have significant influences on mu TBS. The use of each adhesive in either the etch-and-rinse or self-etch application mode did not result in significantly different mu TBS to dentine. Hybrid layers created by these adhesives in the etch-andrinse bonding mode and self-etch bonding mode were similar to 5 mu m and