Removal of adhered UV-curable resin to the microstructure of mold by high hydrostatic pressure treatment

Removal of adhered UV-curable resin to the microstructure of mold by high hydrostatic pressure treatment
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通过高静水压处理去除模具微观结构上粘附的紫外线固化树脂

DOI:
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发表时间:
2015
期刊:
影响因子:
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通讯作者:
Y. Kajiwara and A. Shimizu
Y. Kajiwara and A. Shimizu
中科院分区:
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文献类型:
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作者:
T. Minamide;Y. Kajiwara and A. Shimizu

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