Photonic Integrated Circuits Using Heterogeneous Integration on Silicon
Photonic Integrated Circuits Using Heterogeneous Integration on Silicon
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DOI：
10.1109/jproc.2018.2864668
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发表时间：
2018-12-01
影响因子：
20.6
通讯作者：
Bowers, John E.
中科院分区：
文献类型：
--
作者：
Komljenovic, Tin;Huang, Duanni;Bowers, John E.
采用晶圆键合技术的异质硅光子学正在走向成熟，用于数据中心市场的商业产品正在大量出货。在这里，我们概述了最近在该领域的研究，通过使用两种世界的最佳方法来显示创纪录的器件性能：III-V用于发光，Si用于引导光。利用非均质硅平台的灵活性，展示了窄线宽宽可调谐激光器以及具有记录脉冲功率和脉冲持续时间的完全集成锁模激光器。通过优化的外延生长层堆栈进行多晶片键合的能力被用于实现高性能的光子集成电路，用于通信和传感。除了III-V材料外，非互易材料，例如Ce:YIG也可以被键合，提供额外的功能，如片上隔离器和可重构的片上循环器。随着光子集成芯片复杂性的增加，片上隔离将成为必要，因为光子元件如激光器对反馈效应很敏感。
Heterogeneous silicon photonics using wafer bonding is reaching maturity with commercial products for the data center market being shipped in volume. Here we give an overview of recent research in the area showing record device performance by using the best of both worlds: III-V for light generation and Si for guiding the light. Utilizing the flexibility of the heterogeneous silicon platform, narrow-linewidth widely tunable lasers as well as fully integrated mode locked lasers with record pulse powers and pulse duration were demonstrated. The ability to perform multiple die bonding with optimized epitaxially grown layer stacks was used to realize high-performance photonic integrated circuits both for communications and sensing. In addition to III-V materials, nonreciprocal materials such as, for example, Ce:YIG can be bonded, providing additional functionality such as onchip isolators and reconfigurable on-chip circulators. On-chip isolation will become necessary with the increase in complexity of photonic integrated chips as photonic components such as lasers are sensitive to feedback effects.