Direct Wafer Bonding and Its Application to Waveguide Optical Isolators.
Direct Wafer Bonding and Its Application to Waveguide Optical Isolators.
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DOI：
10.3390/ma5050985
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发表时间：
2012-05-24
期刊：
影响因子：
--
通讯作者：
Takei R
中科院分区：
文献类型：
--
作者：
Mizumoto T;Shoji Y;Takei R
本文综述了直接键合技术在波导光隔离器中的应用。表面活性直接键合技术是实现异种材料间紧密接触的有力工具。该技术具有在低温下结合不同材料的潜在优点，这使得人们能够避免与热膨胀差异相关的问题。使用这种技术，磁光石榴石被成功地键合在硅，III-V族化合物半导体和铌酸锂。作为该技术的一个应用，研究了波导光隔离器，包括干涉型波导光隔离器和半泄漏型波导光隔离器。利用非互易相移的干涉型波导光隔离器适用于各种波导平台。绝缘体上硅（SOI）波导中埋氧层的低折射率增强了磁光相移，这有助于减小隔离器的尺寸。半漏波导光隔离器具有制作公差大、工作波长范围宽等优点。
This paper reviews the direct bonding technique focusing on the waveguide optical isolator application. A surface activated direct bonding technique is a powerful tool to realize a tight contact between dissimilar materials. This technique has the potential advantage that dissimilar materials are bonded at low temperature, which enables one to avoid the issue associated with the difference in thermal expansion. Using this technique, a magneto-optic garnet is successfully bonded on silicon, III-V compound semiconductors and LiNbO3. As an application of this technique, waveguide optical isolators are investigated including an interferometric waveguide optical isolator and a semileaky waveguide optical isolator. The interferometric waveguide optical isolator that uses nonreciprocal phase shift is applicable to a variety of waveguide platforms. The low refractive index of buried oxide layer in a silicon-on-insulator (SOI) waveguide enhances the magneto-optic phase shift, which contributes to the size reduction of the isolator. A semileaky waveguide optical isolator has the advantage of large fabrication-tolerance as well as a wide operation wavelength range.