300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface
300-GHz CMOS Receiver Module with WR-3.4 Waveguide Interface
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具有 WR-3.4 波导接口的 300GHz CMOS 接收器模块
DOI：
10.23919/eumc.2018.8541693
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发表时间：
2018
期刊：
影响因子：
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通讯作者：
M. Fujishima
中科院分区：
文献类型：
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作者：
S. Hara;K. Takano;K. Katayama;R. Dong;K. Mizuno;K. Takahashi;I. Watanabe;N. Sekine;A. Kasamatsu;T. Yoshida;S. Amakawa;M. Fujishima
介绍了具有 WR-3.4 波导接口的 300 GHz CMOS 接收器模块。 CMOS 接收器采用倒装芯片安装在低成本多层玻璃环氧树脂印刷电路板 (PCB) 上。 PCB 中内置了具有背短路结构的传输线到波导的过渡。测得的接收器模块的转换增益、噪声系数和 3dB 带宽分别约为 -23.7dB、33dB 和 18.4GHz。从 CMOS 芯片的转换增益 -19.5 dB 来看，封装损耗估计约为 4 dB。使用设计的模块实现了采用 16-QAM 的 20 Gbit/s 无线数据速率。
A 300-GHz CMOS receiver module with a WR-3.4 waveguide interface is presented. The CMOS receiver is flip-chip mounted on a low-cost multilayered glass epoxy printed circuit board (PCB). A transmission-line-to-waveguide transition with a back-short structure is built into the PCB. The measured conversion gain, noise figure, and 3-dB bandwidth of the receiver module are approximately −23.7 dB, 33 dB and 18.4 GHz, respectively. Packaging loss is estimated to be approximately 4 dB from the conversion gain of the CMOS chip of −19.5 dB. A wireless data rate of 20 Gbit/s with 16-QAM was achieved using the designed modules.