Formation of an embedded electrical circuit in glass substrate by solid-state ion exchange with application of a forward/reverse voltage
Formation of an embedded electrical circuit in glass substrate by solid-state ion exchange with application of a forward/reverse voltage
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通过施加正向/反向电压的固态离子交换在玻璃基板中形成嵌入式电路
DOI：
10.1016/j.precisioneng.2018.09.011
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发表时间：
2019
期刊：
影响因子：
--
通讯作者：
N. Morita
中科院分区：
文献类型：
--
作者：
Hirofumi Kawamura;Ryuta X. Suzuki;S. Matsusaka;H. Hidai;A. Chiba;N. Morita
施加电压的固态离子交换使得能够对碱金属硅酸盐玻璃表面进行金属掺杂。当使用银作为掺杂剂时，施加反向电压产生掩埋在玻璃基板中的银层。银层由具有高导电性的银纳米线的网络组成。在这项工作中，我们进行了实验，在玻璃基板上使用银纳米油墨，有机溶剂含有分散的银纳米粒子印刷在玻璃表面上，作为银离子源形成精细的电气路径。结果，通过依次施加正向和反向电压，形成了细宽度/节距（平均89/16.8 μm）的银沉淀线。我们对电场作用下的离子扩散行为进行了二维数值分析，计算了防止两条相邻谱线重叠的最小谱线间距。在这种方法中，原则上，掩埋的银层通过一些沉淀物连接到玻璃表面，并且我们发现了一种将连接路径限制在设计区域的阴极布置。
Solid-state ion exchange with an applied voltage enables metal doping of alkali-silicate glass surfaces. When the silver is used as the doping agent, application of a reverse voltage produces a silver layer buried in the glass substrate. The silver layer consists of a network of silver nanowires that have high electrical conductivity. In this work, we experimented with forming fine electrical paths in a glass substrate using silver nano-ink, an organic solvent containing dispersed silver nanoparticles printed on the glass surface, as the silver ion source. As a result, silver precipitation line of fine width/pitch (89/16.8 μm on average) were formed by sequentially applying forward and reverse voltages. We carried out a two-dimensional numerical analysis of the ionic diffusion behavior under an electric field to calculate the minimum line interval that would prevent two adjacent lines from overlapping. In this method, the buried silver layer is, in principle, connected to the glass surface via some precipitations, and we found an arrangement for the cathodes that confines the connection paths to the designed areas.