Brazing silicon nitride to an iron-based intermetallic using a copper interlayer
Brazing silicon nitride to an iron-based intermetallic using a copper interlayer
复制标题
DOI：
10.1016/j.ceramint.2003.10.011
复制
发表时间：
2004
影响因子：
5.2
通讯作者：
M. Brochu;M. Pugh;R. Drew
中科院分区：
文献类型：
--
作者：
M. Brochu;M. Pugh;R. Drew
证明了添加铜中间层以吸收钎焊到铁铝合金的氮化硅（Si3N4）陶瓷在冷却期间产生的残余应力的效果。差示扫描量热法（DSC）的结果表明，铜中间层在稀释高钛含量的钎焊合金的积极影响，通过减少可用于反应的活性钎焊合金（ABA）的量。用低电压线扫描场发射扫描电镜（FESEM）研究了反应层的形成机理，结果表明反应层的形成是TiN和Ti5Si3层之间的生长竞争。计算出反应层形成的活化能为137kJ/mol。观察到在Cu中间层与FA-129之间的界面处的Fe/Cu-Ti合金反应。该反应区的厚度可达100 μ m。获得的最大弯曲强度为160MPa。所有断裂均发生在Cu/Si3N4界面处，表明FA-129/Cu界面具有更高的强度。
The effect of adding a copper interlayer to absorb the residual stresses produced during cooling of a silicon nitride (Si3N4) ceramic brazed to an iron aluminide alloy was demonstrated. Differential scanning calorimetry (DSC) results showed the positive influence of the copper interlayer in diluting the high-titanium content brazing alloy by decreasing the quantity of active brazing alloy (ABA) available for reaction. The reaction layer formation mechanism was investigated by low voltage line scan FESEM and was shown to consist of a growth competition between the TiN and Ti5Si3layer. An activation energy of 137kJ/mol for the reaction layer formation was calculated. A Fe/Cu–Ti alloy reaction at the interface between the Cu interlayer and the FA-129 was observed. This reaction zone extended up to 100μm in thickness. The maximum bending strength obtained was 160MPa. All fractures occurred at the Cu/Si3N4interface, suggesting higher strengths for the FA-129/Cu interface.