Physics-based CAD models for the analysis of vias in parallel-plate environments
Physics-based CAD models for the analysis of vias in parallel-plate environments
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DOI：
10.1109/22.954773
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发表时间：
2001-10
影响因子：
4.3
通讯作者：
R. Abhari;G. Eleftheriades;E. V. Deventer-Perkins
中科院分区：
文献类型：
--
作者：
R. Abhari;G. Eleftheriades;E. V. Deventer-Perkins
本文基于径向传输线理论，建立了并联板环境下通孔和埋孔的基于物理的计算机辅助设计模型。对TEM平行板模式下通孔间传递的串扰功率进行了表征，并利用像理论将其推广到有限基板上通孔的处理中。所提出的CAD模型可以结合集总和分布电路元件，以及线性和非线性器件，为高速电子电路的全局建模提供了一个准确和快速的过程。与全波模拟相比，代表性的单通孔或多通孔配置的相应模拟时间大大减少，同时保持相当的精度。
In this paper, physics-based computer-aided-design (CAD) models for through and buried vias in parallel-plate environments are presented based on radial transmission-line theory. The crosstalk power transferred by the TEM parallel-plate mode between vias is characterized, and extended to the treatment of vias in finite substrates by means of image theory. The presented CAD models can be combined with lumped and distributed circuit elements, as well as linear and nonlinear devices, providing an accurate and fast procedure for the global modeling of high-speed electronic circuits. The corresponding simulation time for representative single or multiple via configurations has been drastically reduced compared to full-wave simulations while maintaining comparable accuracy.