The influence of artificial diamond additions on the formation and properties of an electroplated copper metal matrix coating
The influence of artificial diamond additions on the formation and properties of an electroplated copper metal matrix coating
复制标题
DOI：
10.1016/s0257-8972(03)00224-x
复制
发表时间：
2003-05-22
影响因子：
5.4
通讯作者：
Bikulcius, G
中科院分区：
文献类型：
--
作者：
Medeliene, V;Stankevic, V;Bikulcius, G
当微米级人造金刚石颗粒被引入到电镀铜基体中时，基体的耐久性性能得到改善。这些金刚石颗粒对金属基体具有硬化作用，其显微硬度增加了四倍。铜复合涂层的特点是在170至400 K的温度范围内具有低电阻率。该复合材料基体具有细晶结构，并显示出较高的电阻率。表面的微观粗糙度增加; Ra为0.6-0.8，而纯铜的Ra为0.29。在370 K下热处理后，铜复合涂层变得稍软（从750到394 kgf/mm（2）），与纯铜涂层（从180到160 kgf/mm（2）2）相比。对于纯铜涂层和复合涂层，热稳定性具有高达600 K的温度极限。(C)2003 Elsevier Science B. V.保留所有权利。
The matrix durability properties were improved when micrometer-sized artificial diamond particles were incorporated into an electroplated copper matrix. Those diamond particles have a hardening effect on the metal matrix and its microhardness is increased fourfold. Copper composite coatings are distinguished for their low electrical resistivity in a temperature range from 170 to 400 K. The composite matrix has a fine-crystallitic structure and shows higher electrical resistivity. The microroughness of the surface increased; the Ra is 0.6-0.8, whereas the Ra of pure Cu is 0.29. The copper composite coating became a little softer (from 750 to 394 kgf/mm(2)) after heat treatment at 370 K in contrast to a pure copper coating (from 180 to 160 kgf/mm(2) 2). The thermal stability has a temperature limit up to 600 K both for a pure copper coating and a composite coating. (C) 2003 Elsevier Science B.V. All rights reserved.