Nanoscale Stress Localization Effects on the Radiation Susceptibility of GaN High‐Mobility Transistors
Nanoscale Stress Localization Effects on the Radiation Susceptibility of GaN High‐Mobility Transistors
复制标题
纳米级应力局域化对 GaN 高迁移率晶体管辐射敏感性的影响
DOI:
10.1002/pssr.202200171
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发表时间:
2022
期刊:
影响因子:
--
通讯作者:
Pearton, Stephen
中科院分区:
文献类型:
--
作者:
Rasel, Md Abu;Stepanoff, Sergei;Haque, Aman;Wolfe, Douglas E.;Ren, Fan;Pearton, Stephen
Nanoscale localized mechanical stress fields develop unavoidably in microelectronic devices due to structural and processing aspects. Their global average is too small to influence bandgap or mobility, but it is proposed that stress localization can influence defect nucleation sites under radiation. This is investigated on gallium nitride high‐electron‐mobility transistors (GaN HEMTs). Using transmission electron microscopy, we spatially resolved the stress field in the AlGaN layer for both pristine and 10 Mrad gamma‐irradiated HEMTs. The quantitative nanobeam electron diffraction and geometric phase analysis indicate that tensile stressed localizations experience higher radiation‐induced strain. This finding is explained by the tensile stress dependence of the carrier concentration and mobility in the AlGaN layer. Since gamma radiation damage is inflicted by high‐energy electrons only, localized regions of higher tensile stress in the AlGaN layer are expected to be more susceptible to gamma rays.