Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond
Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond
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DOI：
10.1007/s11661-013-1725-8
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发表时间：
2013-07-01
影响因子：
2.8
通讯作者：
Larsson, Andreas
中科院分区：
文献类型：
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作者：
Tollefsen, Torleif Andre;Lovvik, Ole Martin;Larsson, Andreas
研究了温度对优化的Au-Sn固液互扩散滑动键（一种可靠的高温模具连接和互连技术）的模具剪切强度的影响。随着温度的升高，抗剪强度从室温下的140 MPa大幅降低到573 K（300℃）下的20 MPa。这种减少是出乎意料的，因为Au-Sn滑动键的熔点是795 K（522℃）。断口学研究表明，随着温度的升高，裂缝模式发生了变化。这项工作强调了在预期应用温度下进行粘结强度量化的重要性。
The effect of temperature on the die shear strength of a optimized Au-Sn solid-liquid interdiffusion SLID bond, a reliable high temperature die attach and interconnect technology, was investigated. The shear strength was greatly reduced with temperature from 140 MPa at room temperature to 20 MPa at 573 K (300 A degrees C). This reduction was unexpected since the melting point of a Au-Sn SLID bond is 795 K (522 A degrees C). Fractographic studies revealed a change in fracture mode with increasing temperatures. This work emphasizes the importance of performing bond strength quantification at the intended application temperature.