Processing characteristics of ultrathin SrTiO3 ceramic substrates
Processing characteristics of ultrathin SrTiO3 ceramic substrates
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DOI：
10.1504/ijnm.2017.10005593
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发表时间：
2017-07
影响因子：
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通讯作者：
Pan Jisheng;Guoming Li;Q. Yan;Xiaowei Zhang
中科院分区：
文献类型：
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作者：
Pan Jisheng;Guoming Li;Q. Yan;Xiaowei Zhang
针对片状、软脆、翘曲度大的SrTiO 3陶瓷基片的断裂问题，提出了一种新的防断裂双面研磨方法。该方法首先去除了基片表面凸峰处最薄厚度仅为0.19 mm但翘曲达0.6 mm的材料。然后去除更多的材料，最终得到平整无破损的SrTiO 3衬底。SrTiO 3基片材料去除的主要方式是晶粒被磨料碾压破碎，同时也有部分晶粒被拔出。随着材料的去除，基底表面变得更高密度。用1.5 μm的Al_2O_3浆料，用这种方法得到了Ra为0.0285 μm的表面。采用团簇磁流变抛光工艺，获得了Ra为0.0038 m的超光滑表面，表面晶界和粗晶组织清晰可见。
To solve the fracture problem of ultrathin, soft-brittle and large warp SrTiO3 ceramic substrates, a new anti-broken two-sided lapping method was proposed. With this new method, the materials at the convex peak of the substrate surface which thinnest thickness is only 0.19 mm but warp up to 0.6 mm were removed firstly. Then more and more materials were removed and a flat SrTiO3 substrate without broken was obtained ultimately. The main material removal method of SrTiO3 substrate was the fracture of the crystallites rolled by abrasive, while some crystallites were pulled out. As the material was removed, the substrate surface became higher density. Using 1.5 μm Al2O3 slurry, a surface with Ra 0.0285 μm was obtained by using this method. An ultra-smooth surface with Ra 0.0038 m was achieved by cluster magnetorheological polishing, the grain boundary and coarse grain structure on the surface could be seen clearly.