Wafer handling with levitation
Wafer handling with levitation
复制标题
悬浮晶圆处理
DOI:
10.1142/s0960313192000133
复制
发表时间:
1992
期刊:
影响因子:
--
通讯作者:
Thangali Seshadri
中科院分区:
文献类型:
--
作者:
A. Koh;R. Ford;Thangali Seshadri
The semiconductor industry is constantly looking for cleaner and safer methods of handling and transporting semiconductor wafers during manufacturing. This paper describes research on the use of levitation to handle and move wafers. An articulated arm manipulates a small platform which carries a single wafer by means of levitation. Both gas-bearing and magnetic levitation are employed. Several gas platforms of different designs are built. Each can support a wafer with a cushion of gas issuing from the top of the platform. Any lateral drift of the wafer is counteracted by tilting the platform. In the most advanced configuration, the platform consists of three fingers. The spaces between the fingers permit two platforms to interfit thus allowing transfer of the wafer from one platform to the other without contact. The fingers also have suction on the side to withdraw turbulence around the wafer. A ‘maglev’ platform is built which uses a fluctuating magnetic field to levitate a conductive wafer holder. Stable and complete levitation are achieved in all the platforms for gaseous environments, but only the maglev platform can operate in a vacuum. The experiments prove the feasibility of levitation for wafer handling but more refinement is required.