The Protrusion Behaviors in Cu-TSV during Heating and Cooling Process
The Protrusion Behaviors in Cu-TSV during Heating and Cooling Process
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Cu-TSV 加热和冷却过程中的突出行为
DOI：
10.5104/jiepeng.11.e17-014-1
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发表时间：
2018
期刊：
影响因子：
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通讯作者：
J. Onuki
中科院分区：
文献类型：
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作者：
B. Liu;A. Satoh;Kunihiro Tamahashi;Y. Sasajima;J. Onuki
采用fiNite元分析方法，研究了热释光开关结构中铜的凸出现象和热应力。当TSV模型从25℃加热到100℃、200℃、300℃、400℃，然后冷却到25℃时，估计了铜凸出高度随退火温度的变化。从凸出高度-温度滞后曲线可以看出，铜表现出可逆热膨胀和不可逆塑性变形的组合，且经退火处理后不能恢复。由于Coeffi热膨胀系数的大失配，塑性变形开始于铜和硅-通孔界面的顶部。热致塑性flOW导致铜在热释光腔内凸出。在400℃时，铜凸出高度的模拟值和实验值分别为0.93μm和1.02μm，验证了该模型的有效性。
The Cu protrusion phenomena and thermal stresses in TSV structures were studied using finite element analysis. When the TSV model was heated from 25°C to 100°C, 200°C, 300°C, 400°C and then cooled down to 25°C, the change of the Cu protrusion height was estimated as a function of annealing temperature. It is concluded from the protrusion height-temperature hysteresis curve that Cu shows a combination of reversible thermal expansion and irreversible plastic deformation which cannot be recovered after annealing the Cu protrusion. The plastic deformation has been found to initiate at the top of the Cu and Si-via interface because of the large mismatch in the coefficients of thermal expansion. The thermally induced plastic flow causes Cu protrusion in the TSV. The simulation and experimental values of Cu protrusion height are respectively 0.93 μ m and 1.02 μ m at 400°C, showing the validity of the present model.