Spool-packaging of shape memory alloy actuators: Performance model and experimental validation
Spool-packaging of shape memory alloy actuators: Performance model and experimental validation
复制标题
形状记忆合金执行器的线轴封装：性能模型和实验验证
DOI：
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
N. Johnson
中科院分区：
文献类型：
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作者：
John A. Redmond;D. Brei;J. Luntz;A. Browne;N. Johnson
线状形状记忆合金 (SMA) 执行器因其简单的架构和电气操作以及高产量和低成本的可制造性而颇具吸引力。虽然 SMA 执行器以其在智能材料中卓越的工作密度而闻名，但封装中等到大运动所需的长 SMA 线是一项持续的技术挑战。本文研究了假脱机作为一种封装方法，以提供更紧凑的执行器占地面积。导出了分析准静态模型，为线轴封装 SMA 线致动器的分析和合成提供基础工具。该模型根据广义架构以及可指定的几何、材料和负载参数来预测运动。模型预测考虑了局部摩擦损失和弯曲应变的影响，以及由于累积摩擦而产生的“约束”限制。实验验证研究表明，该模型能够根据负载和包装几何形状的形式和幅度很好地预测执行器运动。该模型为绕线封装技术的系统应用提供了基础，以克服 SMA 的封装限制，将 SMA 线致动器定位为许多应用中的可行替代方案。
Shape memory alloy (SMA) actuators in the wire form are attractive because of their simplistic architecture and electrical operation, and their manufacturability at high yields and low cost. While SMA actuators are known for their superior work density among smart materials, packaging long lengths of SMA wire needed for moderate to large motions is an ongoing technical challenge. This article investigates spooling as a packaging approach to provide more compact actuator footprints. An analytical, quasi-static model is derived to provide a foundational tool for the analysis and synthesis of spool-packaged SMA wire actuators. The model predicts motion with respect to a generalized architecture, and specifiable geometric, material, and loading parameters. The model prediction accounts for the effects of local friction loss and bending strains, and for a “binding” limitation due to accumulated friction. An experimental validation study demonstrates the model’s ability to predict actuator motion well in terms of form and magnitude with respect to load and packaging geometry. This model provides a basis for a systematic application of spooled-packaging techniques to overcome packaging limitations of SMA, positioning SMA wire actuators as a viable alternative in many applications.