High thermal stability of submicron grained Cu processed by asymmetrical rolling
High thermal stability of submicron grained Cu processed by asymmetrical rolling
复制标题
非对称轧制亚微米晶粒铜的高热稳定性
DOI:
10.1016/j.matdes.2016.05.084
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发表时间:
2016-09-05
影响因子:
8.4
通讯作者:
Xie, Chaoying
中科院分区:
文献类型:
--
作者:
Li, Wei;Shen, Yao;Xie, Chaoying
In this paper, we report themicrostructure evolutions of symmetrically and asymmetrically rolled Cu at different temperatures, and reveal an important role of asymmetry induced microstructure homogeneity and removal of local severely distorted structures on the enhancement of thermal stability. With the sametotal reduction of 90%, two kinds of submicron grained (SMG) Cuwere processed by symmetrical and asymmetrical rolling respectively. The temperature dependent boundary spacing curves show the asymmetrically rolled Cu has significantly higher thermal stability, with the onset temperature of obvious grain coarsening being 40 degrees C higher than that for symmetrical rolled Cu. The enhanced thermal stability of asymmetrically rolled Cu can be attributed to the retardation of nucleation mainly realized by the improvement in microstructure homogeneity and the removal of local severely distorted structures. Our results demonstrate the feasibility of using asymmetrical rolling to improve the thermal stability of bulk SMG metals. (C) 2016 Elsevier Ltd. All rights reserved.