Evaporation of Cu, Sn, and S from Fe-C-Cu-Sn-S Liquid Alloys in the Temperature Range from 1513 K to 1873 K (1240 °C to 1600 °C)
Evaporation of Cu, Sn, and S from Fe-C-Cu-Sn-S Liquid Alloys in the Temperature Range from 1513 K to 1873 K (1240 °C to 1600 °C)
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Fe-C-Cu-Sn-S 液态合金中 Cu、Sn 和 S 在 1513 K 至 1873 K（1240 °C 至 1600 °C）温度范围内的蒸发
DOI：
10.1007/s11663-018-1198-7
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发表时间：
2018
期刊：
影响因子：
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通讯作者：
Youn‐Bae Kang
中科院分区：
文献类型：
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作者：
Fahmi Tafwidli;M. Choi;S. Yi;Youn‐Bae Kang
对含C和S的铁液中铜、锡的蒸发进行了实验研究。液态合金中的初始C浓度[pct C]0从零变化到C饱和，蒸发温度从1513℃到1773℃(1240℃到1500℃)变化。结合作者的报告，提出了液态Fe-C-S合金中铜和锡的蒸发机理。研究表明，铜和锡以Cu(G)和Sn(G)的形式挥发，也以挥发性较强的CuS(G)和SnS(G)形式挥发。因此，合金中S的存在会影响铜和锡的总挥发速率。同时，合金中的C还形成挥发性硫化碳化物CS(G)和CS2(G)，从而与铜和锡竞争。此外，C增加了铜、锡和硫的活度系数，从而增加了生成CuS(G)和SnS(G)的热力学驱动力。因此，[PctC]的增加通过增加活度系数来部分加速铜和锡的蒸发速度，但通过降低有效S含量来部分减缓铜和锡的蒸发速度。S通过增加硫化物气体物种的有效S部分地加快了蒸发速率，但由于表面毒化效应而部分地减缓了蒸发速率。提高反应温度会增加总的蒸发速率。为了建立蒸发率模型，综合考虑了这些因素。该模型考虑了(1)CS(G)、S(G)和Cs2(G)(因此，下列物种是主要的蒸发物种：Cu(G)、CuS(G)、SnS(G)、S(G)、CS(G)和Cs2(G))：(2)C和温度对铜、锡和S活度系数的影响；(3)C和温度对液态合金密度的影响；温度对S吸附系数的影响。用修正后的蒸发模型对实验数据进行了解释，与实验数据吻合较好。其中，温度对蒸发速率有显著影响，温度和碳含量对铜、锡和S的活度系数也有显著影响。可以得到单个蒸发反应的化学反应速率常数()和剩余速率常数()作为温度的函数。推导了各蒸发反应的活化能，并进行了讨论。蒸发率模型可用于预测不同温度和[Pct C]条件下铁液中残留的铜和锡的含量。
Evaporation of Cu or Sn from liquid iron alloys containing C and S was experimentally investigated. The initial C concentration, [pct C]0, in the liquid alloy was varied from zero to C saturation, and the evaporation temperature was varied from 1513 K to 1773 K (1240 °C to 1500 °C). Along with the report by one of the present authors, the evaporation mechanism of Cu and Sn from liquid Fe-C-S alloy is proposed, after a modification from the previous mechanism. It was proposed that Cu and Sn evaporate as Cu(g) and Sn(g) and also evaporate as CuS(g) and SnS(g), which are more volatile species. Therefore, availability of S in the alloy affects the overall evaporation rate of Cu and Sn. At the same time, C in the alloy also forms volatile carbosulfides CS(g) and CS2(g), thereby competing with Cu and Sn. Moreover, C increases the activity coefficients of Cu, Sn, and S. This increases the thermodynamic driving force for the formation of CuS(g) and SnS(g). Therefore, increasing [pct C] partly accelerates the evaporation rate of Cu and Sn by increasing the activity coefficient but partly decelerates the evaporation rate by lowering the available S content. S partly accelerates the evaporation rate by increasing the available S for the sulfide gas species but partly decelerates the evaporation rate due to the surface poisoning effect. Increasing the reaction temperature increases the overall evaporation rate. All these facts were taken into account in order to develop an evaporation rate model. This model was extended from the present authors’ previous one by taking into account (1) CS(g), S(g), and CS2(g) (therefore, the following species were considered as dominant evaporating species: Cu(g), CuS(g), Sn(g), SnS(g), S(g), CS(g), and CS2(g)); (2) the effect of C and temperature on the activity coefficients of Cu, Sn, and S; (3) the effect of C and temperature on the density of the liquid alloy; and (4) the effect of temperature on the S adsorption coefficient. This revised evaporation model was used in order to explain the experimental data, and it showed good agreement. In particular, it was found that the temperature showed a significant effect on the evaporation rate, and the effect of temperature and C content on the activity coefficients of Cu, Sn, and S also significantly affected the evaporation rate. The chemical reaction rate constant of the individual evaporation reaction () and residual rate constant () could be obtained as a function of temperature. The activation energy of each evaporation reaction was derived and discussed. The evaporation rate model can be applied in order to predict the content of Cu and Sn remaining in liquid iron under various conditions of temperature and [pct C].