Effects of Ethylenediamine Tetrakis(ethoxylate-block-propoxylate) Tetrol on Tin Electrodeposition
Effects of Ethylenediamine Tetrakis(ethoxylate-block-propoxylate) Tetrol on Tin Electrodeposition
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DOI：
10.1016/j.electacta.2022.140476
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发表时间：
2022-05
影响因子：
6.6
通讯作者：
Yang Hu;K. Ahammed;Q. Liu;Rashad Williams;Qiang Huang
中科院分区：
文献类型：
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作者：
Yang Hu;K. Ahammed;Q. Liu;Rashad Williams;Qiang Huang
研究了乙二胺四（乙氧基-嵌段-丙氧基）四醇（ETT）存在下锡（Sn）的电沉积。采用循环伏安法、计时电流法和计时电位法研究了锡在ETT存在下的电化学行为。系统地研究了ETT浓度、转速和电位扫描速率等因素对Sn沉积的影响，发现ETT在一定的负电位范围内抑制Sn沉积是由于ETT的电位依赖性吸附。ETT的这种吸附不仅进一步取决于空的表面分数，而且还取决于被占据的分数或表面覆盖度。此外，使用含有不同ETT官能团的各种添加剂来确定抑制效果的关键结构组分。
Electrodeposition of Tin (Sn) is studied in the presence of ethylenediamine tetrakis(ethoxylate-block-propoxylate) tetrol (ETT). Cyclic voltammetry (CV), chronoamperometry, and chronopotentiometry are conducted to characterize the electrochemical behavior of Sn with the addition of ETT. Several influencing factors such as the ETT concentration, rotation rate, and potential scan rate are systematically investigated, and it is found that ETT suppresses Sn deposition at a certain negative potential range due to a potential dependent adsorption of ETT. This adsorption of ETT is further dependent not only on the empty surface fraction but also the occupied fraction or surface coverage. Moreover, various additives containing different functional groups of ETT are used to determine the key structural component for the inhibition effect.