Fabrication of silver thin film for single-crystalline nanopillar: effects of thickness and grain size

Fabrication of silver thin film for single-crystalline nanopillar: effects of thickness and grain size
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单晶纳米柱银薄膜的制备:厚度和晶粒尺寸的影响

DOI:
10.1007/s00339-015-9497-1
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发表时间:
2015
期刊:
Applied Physics A
影响因子:
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通讯作者:
Tomohiro Mori; Yasuhiro Tanaka; Yoshifumi Suzaki; Kenzo Yamaguchi
Tomohiro Mori; Yasuhiro Tanaka; Yoshifumi Suzaki; Kenzo Yamaguchi
中科院分区:
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文献类型:
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作者:
竹村 明洋;田中 康弘;Tomohiro Mori,Yasuhiro Tanaka,Yoshifumi Suzaki,Kenzo Yamaguchi,;Changdong Chen; Yasushi Ikeuchi; Linfeng Xu; Galhenage A. Sewvandi; Takafumi Kusunose; Yasuhiro Tanaka; Shunsuke Nakanishi; Puhong Wen; Qi Feng;Tomohiro Mori; Yasuhiro Tanaka; Yoshifumi Suzaki; Kenzo Yamaguchi

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具有可控晶体织构的单晶金属纳米结构有望减少光学损失。我们已经尝试仅使用物理技术来制备单晶金属纳米结构。用纳米尺度的电子背散射衍射(EBSD)方法研究了在高透明的二氧化硅衬底上沉积的银膜的晶粒生长机制。EBSD分析表明,在较低厚度的二氧化硅衬底上沉积的银膜具有较强的(111)织构。此外,我们还使用EBSD晶体取向图进行了粒度分析。当薄膜厚度从154 nm增加到1017 nm时,大部分颗粒长大到大约800 nm的尺寸。此外,我们还利用聚焦离子束球磨成功地在(111)取向的大颗粒中制备了锥形纳米管(下表面直径450 nm),薄膜厚度为1017 nm。采用物理方法在可控银膜中直接制备了单晶银纳米管。
A single-crystalline metallic nanostructure with a controlled crystallographic texture is expected to reduce optical losses. We have attempted to fabricate a single-crystalline metallic nanostructure using a physical technique only. The grain growth mechanism in silver films deposited on a highly transparent SiO2substrate was elucidated by electron backscatter diffraction (EBSD) methods with nanoscale resolution. EBSD analysis suggested that the silver films deposited on SiO2at lower thicknesses have a strong (111) texture. Additionally, we performed a grain size analysis using the EBSD crystal orientation map. When the film thickness increased from 154 to 1017 nm, most of the grains grew to a size of approximately 800 nm. Moreover, we successfully fabricated a conical nanopillar (undersurface diameter 450 nm) in a (111)-oriented large growing grain at the film thickness of 1017 nm by focused ion beam milling. A single-crystalline silver nanopillar was directly fabricated in controlled silver films using only physical processing.