Electroless Copper Plating A Review : Part I By
Electroless Copper Plating A Review : Part I By
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发表时间：
2011
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通讯作者：
C. A. Deckert
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作者：
C. A. Deckert
electrolytic method of deposition from solution. The minimum necessary components of an electroless plating solution are a metal salt and an appropriate reducing agent. An additional requirement is that the solution, although thermodynamically unstable, is stable in practice until a suitable catalyzed surface is introduced. Plating is then initiated upon the catalyzed surface, and the plating reaction is sustained by the catalytic nature of the plated metal surface itself. This definition of electroless plating eliminates both those solutions that spontaneously plate on all surfaces (“homogeneous chemical reduction”), such as silver mirroring solutions; also “immersion” plating solutions, which deposit by displacement a very thin film of a relatively noble metal onto the surface of a sacrificial, less noble metal.
