Surface functionalization of PTFE sheet through atmospheric pressure plasma liquid deposition approach
Surface functionalization of PTFE sheet through atmospheric pressure plasma liquid deposition approach
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DOI：
10.1016/j.surfcoat.2008.06.006
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发表时间：
2008-08-30
影响因子：
5.4
通讯作者：
Yamamura, Kazuya
中科院分区：
文献类型：
--
作者：
Zettsu, Nobuyuki;Itoh, Hiroto;Yamamura, Kazuya
利用常压等离子体液体沉积(APPLD)技术对聚四氟乙烯(PTFE)表面进行了束状铜金属化处理，设计了高频电子器件的接口。我们发现，在大气压氦等离子体作用下，聚四氟乙烯表面覆盖有金属离子捕集聚合物聚(4-乙烯基吡啶)和醋酸铜的薄层液膜，同时提供了等离子体诱导的直接接枝聚合和Cu2+的还原。用水接触角测量、X射线光电子能谱和原子力显微镜等分析技术对改性后的表面进行了表征。(C)2008年爱思唯尔FIN。版权所有。
We demonstrated here fascicle copper (Cu) metallization of poly(tetrafluoroethylene) [PTFE] surface through an atmospheric pressure plasma liquid deposition [APPLD] technique to design the interface for high frequency electronic devices. We found that exposing with atmospheric pressure helium plasma to the PTFE surface covered with thin liquid film, containing both poly(4-vinylpyridine) as a metal ion trapping polymer and copper acetate, simultaneously offered the plasma-induced direct graft polymerization and the reduction of Cu2+. The modified surface was characterized by using several analytical techniques, including water contact angle measurement, X-ray photoelectron spectroscopy, and atomic force microscopy. (C) 2008 Elsevier FIN. All rights reserved.