Thermal bonding of polymeric capillary electrophoresis microdevices in water
Thermal bonding of polymeric capillary electrophoresis microdevices in water
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DOI：
10.1021/ac0262964
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发表时间：
2003-04-15
影响因子：
7.4
通讯作者：
Woolley, AT
中科院分区：
文献类型：
--
作者：
Kelly, RT;Woolley, AT
提出了一种热粘合聚甲基丙烯酸甲酯（PMMA）基板形成微流体系统的新方法。PMMA衬底首先用施加压力和升高温度的Si模板压印以形成微通道结构。朱必思压花方法已成功地使用一个单一的Si模板超过65 PMMA片图案。通道封闭的热粘合是通过将印迹和空白底物夹紧在一起并将其置于沸水中1小时来完成的。通过对荧光标记的氨基酸进行高分辨率电泳分离，证明了这些水粘合微流控底物的功能。4个微器件的粘结强度测试显示，平均失效压力为130 kPa，与密封在空气中的器件的粘结强度相当。随后对分离基板的轮廓测量显示，通道的尺寸在键合过程中得到了很好的保存。这种用于生成微流控结构的新方法应该有助于将水合的、分子大小选择的膜永久地结合到微装置中，从而避免了暴露于水时微流控系统中膜膨胀的相关问题。
A new method for thermally bonding poly(methyl methacrylate) (PMMA) substrates to form microfluidic systems has been demonstrated. A PMMA substrate is first imprinted with a Si template using applied pressure and elevated temperature to form microchannel structures. Ibis embossing method has been used to successfully pattern over 65 PMMA pieces using a single Si template. Thermal bonding for channel enclosure is accomplished by clamping together an imprinted and a blank substrate and placing the assembly in boiling water for 1 h. The functionality of these water-bonded microfluidic substrates was demonstrated by performing high-resolution electrophoretic separations of fluorescently labeled amino acids. Testing of bond strength in four microdevices showed an average failure pressure of 130 kPa, which was comparable to the bond strength for devices sealed in air. Subsequent profilometry of separated substrates revealed that the dimensions of the channels were well preserved during the bonding process. This new methodology for generation of microfluidic constructs should facilitate the permanent incorporation of hydrated, molecular size-selective membranes in microdevices, thus circumventing problems associated with membrane swelling in microfluidic systems upon exposure to water.