Joining nitride ceramics
Joining nitride ceramics
复制标题
氮化物陶瓷的接合
DOI:
10.1016/0272-8842(95)00134-4
复制
发表时间:
1996
影响因子:
5.2
通讯作者:
S. Peteves
中科院分区:
文献类型:
--
作者:
S. Peteves
Nitride ceramics are gaining importance in advanced technology applications. Examples include high temperature engine components of Si3N4, heat dissipating electronic substrates of AlN, and chemically inert cutting tools of cubic BN. The effective and widespread use of nitrogen ceramics in these and other applications, however, depends on the ability to bond them to metals, as well as to other ceramics. Bonding ceramics to metals is inherently difficult because of their non-metallic characteristics, and this can be aggravated for nitride ceramics by their tendency to dissociate in vacua. The successful production of reliably strong joints by diffusion bonding and brazing with reactive filler metals is discussed. Reference will be made to the joining of AlN, BN and particularly Si3N4using alloys containing reactive elements, and comments will be made on the influence of process and parameters such as temperature, environment and ceramic surface preparation on the microstructure, mechanical properties and high temperature stability of interfaces.