Effect of Electrodeposition Conditions on Surface Roughness of Copper Electroformed Replicas
Effect of Electrodeposition Conditions on Surface Roughness of Copper Electroformed Replicas
复制标题
电沉积条件对铜电铸复制品表面粗糙度的影响
DOI：
10.2526/ijem.25.33
复制
发表时间：
2020
期刊：
影响因子：
--
通讯作者：
H. Mimura
中科院分区：
文献类型：
--
作者：
G. Yamaguchi;H. Mimura
随着超精密加工方法的最新发展，已经实现了具有亚10 nm形状精度和原子级表面光滑度的器件的制造。然而，制造这样的精密装置需要大量的工作和时间。电铸，一种利用电沉积的复制技术，有望成为这些器件的有效制造工艺。在本文中，我们报告的基础研究电铸复制的超光滑母版。使用均方根表面粗糙度为0.1 nm的光滑浮法玻璃基材作为母版。制备了铜电铸复制品，以研究电沉积条件与复制品表面粗糙度之间的关系。实验结果表明，电镀膜的微观结构影响复制品的表面粗糙度。
With recent developments in ultraprecision machining methods, the manufacture of devices with sub 10 nm shape accuracy and with surface smoothness at the atomic level has been realized. However, it takes a lot of work and time to fabricate such precise devices. Electroforming, a replication technique using electrodeposition, is expected to be an efficient fabrication process for these devices. In this paper, we report fundamental research on electroform replication of ultra-smooth masters. Smooth float glass substrates that have a root-mean-square surface roughness of 0.1 nm were used as masters. Copper electroformed replicas were fabricated to investigate the relationship between electrodeposition conditions and surface roughness of the replicas. Experimental results indicate that the microstructures of the electroplated films affect the surface roughness of replicas.