Thermal aware design methodology for small signal discrete products
Thermal aware design methodology for small signal discrete products
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小信号分立产品的热感知设计方法
DOI：
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
R. Quade
中科院分区：
文献类型：
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作者：
S. Holland;M. Rover;H. Kuhl;H. Witt;R. Quade
提出了一种在PCB级上对分立半导体器件进行电热仿真的方法。通过结合有限元仿真工具FloTherm和Sentaurus，可以减少计算时间，从而可以将周围环境纳入到三维模型中。这是通过使用FloTherm提取热阻来实现的，FloTherm被插入Sentaurus作为热边界条件。该方法已通过对一组采用不同封装和PCB布局的分立器件进行热测量得到验证。仿真结果与实测结果吻合较好。
A methodology for electro-thermal simulations of discrete semiconductor devices on PCB level is presented. By combining the finite element simulation tools FloTherm and Sentaurus the computation time can be reduced so that it is possible to include the surrounding ambient into the electrothermal model. This is achieved by extraction of thermal resistances using FloTherm which are inserted into Sentaurus as thermal boundary conditions. This approach has been verified with thermal measurements for a set of discrete devices in different packages and PCB layouts. The simulation results agree well with measurement.