An experimental investigation into micro ball end-milling of silicon
An experimental investigation into micro ball end-milling of silicon
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DOI：
10.1016/j.jmapro.2011.09.004
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发表时间：
2012
影响因子：
6.2
通讯作者：
M. Arif;Mustafizur Rahman;Wong Yoke San
中科院分区：
文献类型：
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作者：
M. Arif;Mustafizur Rahman;Wong Yoke San
硅是半导体和微电子的代表性操作材料。在某些MEMS应用中，需要在硅衬底上制作三维通道和复杂图案。这些特征通常通过光刻和化学蚀刻来制造。这些方法具有低生产率并且具有某些其它限制。因此，非常需要从非传统制造工艺到传统加工的可行转换，以提高高混合小批量生产的生产率。然而，由于硅的高脆性，用传统工艺加工硅是非常困难的。即使在加工过程中产生非常小的力也会导致硅表面脆性断裂，从而导致表面质量恶化。加工脆性材料（如硅）的基本原理是通过塑性变形而不是裂纹扩展来实现材料去除。本文介绍了微球端铣加工硅材料的实验结果。工件表面倾斜于刀具的旋转轴线，以提高表面光洁度。实验证明，当进给速度低于一定阈值时，微球端铣可以在硅片上加工出15 μm深的无毛刺槽。研究了几种加工参数对加工表面粗糙度的影响。立方氮化硼（CBN）被认为是一种可替代单晶金刚石用于硅塑性加工的经济型工具材料。
Silicon is a representative operational material for semiconductor and micro-electronics. In certain MEMS applications, it is required to fabricate three dimensional channels and complex pattern on silicon substrate. Such features are typically fabricated by photolithography and chemical etching. These processes have low productivity and have certain other limitations. Therefore, a viable switch-over from non-traditional fabrication processes to traditional machining is highly desired for improved productivity in high-mix low-volume production. However, machining of silicon by traditional process is extremely difficult due to its high brittleness. Even very small forces produced during machining can cause brittle fracture on silicon surface resulting in deteriorated surface quality. The fundamental principle in machining of a brittle material such as silicon is to achieve material removal through plastic deformation rather than crack propagation. This paper presents the experimental results of ductile-mode machining of silicon by micro ball end-milling. The workpiece surface was inclined to the rotational axes of the cutter to improve the surface finish. It was established experimentally that 15-μm deep, fracture-free slots can be machined on silicon wafer by micro ball end-milling if the feed rate is below a certain threshold. The influence of several machining parameters on the roughness of machined-surface was also investigated. Cubic boron nitride (CBN) is presented as much economical alternative tool-material to single-crystal diamond for machining silicon in ductile-mode.