Reliability Modeling and Management of Nanophotonic On-Chip Networks
Reliability Modeling and Management of Nanophotonic On-Chip Networks
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DOI：
10.1109/tvlsi.2010.2089072
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发表时间：
2012
影响因子：
2.8
通讯作者：
Zheng Li;Moustafa Mohamed;X. Chen;E. Dudley;Ke Meng;L. Shang;A. Mickelson;R. Joseph;Manish Vachharajani;Brian Schwartz;Yihe Sun
中科院分区：
文献类型：
--
作者：
Zheng Li;Moustafa Mohamed;X. Chen;E. Dudley;Ke Meng;L. Shang;A. Mickelson;R. Joseph;Manish Vachharajani;Brian Schwartz;Yihe Sun
虽然近年来晶体管性能和能效显著提高，但电气互连的改进未能跟上步伐。纳米光子制造的最新进展使片上光学成为一种有吸引力的替代方案。然而，系统集成的挑战依然存在。特别是，片上纳米光子结构的参数对制造引起的工艺变化和整个管芯的运行时空间热变化很敏感。这项工作解决了性能和可靠性的挑战，从这种变化的敏感性。本文首先提出了一个模型，预测纳米光子网络中的热和工艺变化的系统级影响。然后，它展示了如何优化众核系统的性能和可靠性，通过使用运行时技术来补偿热和工艺变化的影响。
While transistor performance and energy efficiency have dramatically improved in recent years, electrical interconnect improvements has failed to keep pace. Recent advances in nanophotonic fabrication have made on-chip optics an attractive alternative. However, system integration challenges remain. In particular, the parameters of on-chip nanophotonic structures are sensitive to fabrication-induced process variation and run-time spatial thermal variation across the die. This work addresses the performance and reliability challenges that arise from this sensitivity to variation. The paper first presents a model predicting the system-level effects of thermal and process variation in nanophotonic networks. It then shows how to optimize many-core system performance and reliability by using run-time techniques to compensate for the thermal and process variation effects.