Origins of unintentional incorporation of gallium in InAlN layers during epitaxial growth, part II: Effects of underlying layers and growth chamber conditions
Origins of unintentional incorporation of gallium in InAlN layers during epitaxial growth, part II: Effects of underlying layers and growth chamber conditions
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DOI:
10.1016/j.jcrysgro.2013.09.046
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发表时间:
2014-02-15
影响因子:
1.8
通讯作者:
Ryou, Jae-Hyun
中科院分区:
文献类型:
--
作者:
Kim, Jeomoh;Lochner, Zachary;Ryou, Jae-Hyun
We systematically study the origins and mechanisms for unintentional incorporation of gallium (Ga) during epitaxial growth of ternary InAlN thin-film layers. The origins of auto-incorporation of Ga have been investigated by using different underlying layers, regrown layers, and growth chamber conditions. It is shown that Ga-containing deposition on a wafer susceptor/carrier and on surrounding surfaces of uncooled parts in a growth chamber can be responsible for Ga in the InAl(Ga)N layers, while a GaN underlying layer below an InAl(Ga)N layer does not contribute to the auto incorporation of Ga in the InAl (Ga)N layers. Especially, the Ga-containing deposition on the surfaces inside the chamber is believed to be the dominant source of auto incorporated Ga, possibly due to the high vapor pressure of a liquid phase as a result of eutectic system formation between indium (In) and Ga. The pressure of liquid phase Ga, p(Ga)=similar to 3.67 x 10(-4) Torr, can be significant as compared to precursor partial pressures with P-TMAI=3.7 x 10(-4) Toff and p(TMIn)=24 x 10(-5) Torr. In addition, magnesium (Mg) or magnesium precursor (Cp2Mg) in the growth chamber is shown to promote the auto incorporation of Ga in the InAl(Ga)N layers. (C) 2013 Elsevier B.V. All rights reserved