Coil array design for maximizing wireless power transfer to sub-mm sized implantable devices
Coil array design for maximizing wireless power transfer to sub-mm sized implantable devices
复制标题
线圈阵列设计可最大程度地实现向亚毫米尺寸植入设备的无线功率传输
DOI：
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发表时间：
2017
期刊：
影响因子：
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通讯作者：
R. Etienne
中科院分区：
文献类型：
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作者：
Yasha Karimi;A. Khalifa;Webert Montlouis;M. Stanaćević;R. Etienne
部署亚毫米尺寸植入式设备的主要挑战之一是通过感应链路传输到这些设备的功率的限制。我们首先获得链路中线圈的最佳尺寸以及在 1.1 GHz 工作频率下使用单个发射线圈可传输到 300 pm × 300 pm 的最大功率。为了提高传输功率，我们在考虑安全限制的情况下引入并优化了发射侧相控线圈阵列的设计。通过添加单个线圈，我们在传输功率方面获得了 1.43 dB 的增益，而通过添加四个发射线圈，可传输到植入设备的功率增加了 4.3 dB，达到 10.6 μW。
One of the main challenges for the deployment of sub-mm sized implantable device is the limit on the power that can be transmitted to these devices through inductive link. We first obtain the optimal sizing of the coils in the link and the maximum power that can be delivered to a 300 pm × 300 pm using single transmitting coil at operating frequency of 1.1 GHz. To increase the delivered power, we introduce and optimize the design of phased coil array at the transmitting side taking into account the safety limits. By adding a single coil we achieve a gain of 1.43 dB in the delivered power, while with the addition of four transmitting coils, the power that can be delivered to the implantable device is increased by 4.3 dB and reaches 10.6 μW.