High performance germanium photodetectors integrated on submicron silicon waveguides by low temperature wafer bonding
High performance germanium photodetectors integrated on submicron silicon waveguides by low temperature wafer bonding
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DOI:
10.1364/oe.16.011513
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发表时间:
2008-07-21
期刊:
影响因子:
3.8
通讯作者:
Lipson, Michal
中科院分区:
文献类型:
--
作者:
Chen, Long;Dong, Po;Lipson, Michal
We demonstrate germanium photodetectors integrated on submicron silicon waveguides fabricated with a low temperature ( 0.4 A/W and an estimated quantum efficiency of above 90%. (C) 2008 Optical Society of America.