Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP
Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP
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CMP 材料去除过程中晶圆和抛光垫之间浆料流中细颗粒行为的研究
DOI：
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发表时间：
2012
期刊：
影响因子：
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通讯作者：
P. Khajornrungruang
中科院分区：
文献类型：
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作者：
K. Kimura;Keisuke Suzuki;P. Khajornrungruang
