Analyses of the spreading kinetics of AgCuTi melts on silicon carbide below 900 °C, using a large-chamber SEM

Analyses of the spreading kinetics of AgCuTi melts on silicon carbide below 900 °C, using a large-chamber SEM
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DOI:
10.1016/j.colsurfa.2014.12.039
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发表时间:
2015-03-05
影响因子:
5.2
通讯作者:
Boettcher, Konrad
Boettcher, Konrad
中科院分区:
化学2区
文献类型:
--
作者:
Tillmann, Wolfgang;Pfeiffer, Jan;Boettcher, Konrad

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