>30 MW peak power from distributed face cooling tiny integrated laser.
>30 MW peak power from distributed face cooling tiny integrated laser.
复制标题
来自分布式面冷微型集成激光器的 >30 MW 峰值功率。
DOI：
10.1364/oe.27.030217
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发表时间：
2019
期刊：
影响因子：
3.8
通讯作者：
T. Taira
中科院分区：
文献类型：
--
作者：
Lihe Zheng;A. Kausas;T. Taira
分布式面冷 (DFC) 芯片由四块 1 毫米长的 Nd:YAG 板制成，这些板夹在四块蓝宝石散热器中，在室温下通过先进的表面活性键合 (SAB) 进行制造。采用可饱和吸收体 Cr4+:YAG 实现了亚纳秒 (665.7ps) 脉冲 DFC 芯片微型集成激光器，输出能量为 21.5 mJ，峰值功率为 32.3 MW。通过有限元分析，我们证实了DFC芯片相对于传统块芯片的散热优势。基于 SAB-DFC 芯片的无处不在的高峰值功率微型集成激光器在实验上已经可以用于激光武装机器人。
The Distributed Face Cooling (DFC) chip was fabricated from four pieces of 1 mm-length Nd:YAG plate sandwiched in four pieces of sapphire heat spreaders through advanced surface activated bonding (SAB) at room temperature. A sub-nanosecond (665.7ps) pulsed DFC-chip tiny integrated laser was achieved with output energy of 21.5 mJ and peak power of 32.3 MW with saturable absorber Cr4+:YAG. By finite element analysis, we confirmed the advantages of heat dissipation from DFC-chip compared with conventional bulk-chip. The SAB-DFC-chip based ubiquitous high peak power tiny integrated laser was experimentally within reach for laser-armed robot.
影响因子：
3.6
作者：
Nubbemeyer, Thomas;Kaumanns, Martin;Krausz, Ferenc
通讯作者：
Krausz, Ferenc