Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging
Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging
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DOI：
10.1016/j.mee.2006.10.027
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发表时间：
2006-11
影响因子：
2.3
通讯作者：
Jeong-Won Yoon;W. Moon;Seung-Boo Jung
中科院分区：
文献类型：
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作者：
Jeong-Won Yoon;W. Moon;Seung-Boo Jung
