Solid-state electrochemical micromachining
Solid-state electrochemical micromachining
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DOI：
10.1021/cm0502929
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发表时间：
2005-04-19
影响因子：
8.6
通讯作者：
Matsumoto, Y
中科院分区：
文献类型：
--
作者：
Kamada, K;Izawa, K;Matsumoto, Y
利用离子导电微电极与金属基底之间的局部阳极反应实现了Ag和Zn箔的固态电化学微细加工。在直流偏压下，金属衬底通过微接触以金属离子的形式局部地结合到离子导体中。
A novel solid-state electrochemical micromachining of Ag and Zn foils was accomplished using a local anodic reaction between the metal substrate and ion-conducting microelectrode. The metal substrate was locally incorporated into the ion conductor in the form of metal ions via the microcontact under a dc bias.