Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets
Fiber-Array-to-Chip Interconnections With Sub-Micron Placement Accuracy via Self-Aligning Chiplets
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DOI：
10.1109/lpt.2022.3199457
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发表时间：
2022-10
影响因子：
2.6
通讯作者：
Shengtao Yu;T. Gaylord;M. Bakir
中科院分区：
文献类型：
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作者：
Shengtao Yu;T. Gaylord;M. Bakir
自对准硅小芯片方法用于带有脊形波导和光栅耦合器的绝缘体上硅 (SOI) 基板，以实现与光纤阵列的互连。该方法通过硅微加工和 3D 打印实现，以可重复的亚微米放置精度实现光纤与光栅的高度可扩展的表面耦合。 1550 nm 处相对于有源光纤对准的耦合效率为 79%。演示了 4 个小芯片上 160 根光纤的插入点。设计、制造和组装工艺共同为光纤到芯片互连提供了潜在的技术。
A self-aligning silicon chiplet approach is used on a silicon-on-insulator (SOI) substrate with ridge waveguides and grating couplers to enable interconnection with arrays of fibers. The approach is enabled by silicon micromachining and 3D printing, achieving highly scalable surface coupling of optical fibers to the gratings at repeatable sub-micron placement accuracies. The coupling efficiency relative to that of active fiber alignment at 1550 nm is 79%. Insertion points for 160 fibers across four chiplets are demonstrated. The design, fabrication and assembly processes together provide a potential technology for fiber-to-chip interconnects.