Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth
Manufacturability and Reliability Screening of Lower Melting Point, Pb-Free Alloys Containing Bismuth
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低熔点含铋无铅合金的可制造性和可靠性筛选
DOI：
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
M. Romansky
中科院分区：
文献类型：
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作者：
J. Juarez;P. Snugovsky;E. Kosiba;Z. Bagheri;S. Suthakaran;M. Robinson;J. Heebink;J. Kennedy;M. Romansky
本文探讨了三种无铅含bi合金与传统SAC305和SnPb组件的可制造性和可靠性。研究中包括的第一种合金是含有3.4%Ag和4.8%Bi的sn基合金，在国家制造科学中心和德国联合项目中显示出令人满意的结果。另外两种合金的含铜和不含铜都降低了银的含量。将BGA和含铅部件组装在中等复杂程度的测试车上，并以SAC305和SnPb为基准合金进行比较。测试车辆使用两种板材料制造，170°C玻璃化转变温度（Tg）和155°C Tg，具有三种表面处理：ENIG， ENEPIG和OSP。加速温度循环（ATC）测试在- 55°C至125°C范围内进行，停留时间为30分钟，斜坡温度为10°C/min，循环3000次。详细描述了ATC测试前后的微观结构检查和失效分析。三种实验合金均显示…
This paper explores the manufacturability and reliability of three Pb-free Bi-containing alloys in comparison with conventional SAC305 and SnPb assemblies. The first alloy included in the study is a Sn-based alloy with 3.4%Ag and 4.8%Bi, which showed promising results in the National Center for Manufacturing Sciences and German Joint projects. The other two alloy variations have reduced Ag content, with and without Cu. BGA and leaded components were assembled on medium-complexity test vehicles using these alloys, as well as SAC305 and SnPb as baseline alloys, for comparison. Test vehicles were manufactured using two board materials, 170°C glass transition temperature (Tg) and 155°C Tg, with three surface finishes: ENIG, ENEPIG, and OSP. The accelerated temperature cycling (ATC) testing was done at −55°C to 125°C with 30-min dwells and 10°C/min ramps, for 3,000 cycles. Detailed microstructure examination before and after ATC testing is described, as is failure analysis. All three experimental alloys showed...