Characterization of an epoxy filler for piezocomposites compatible with microfabrication processes.
Characterization of an epoxy filler for piezocomposites compatible with microfabrication processes.
复制标题
与微加工工艺兼容的压电复合材料环氧填料的表征。
DOI：
10.1109/tuffc.2011.2137
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
Bernassau AL
中科院分区：
文献类型：
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作者：
Bernassau AL
高分辨率医学成像需要能够在30 MHz以上频率下工作的微型超声换能器阵列。实现这一点的一种方法是使用基于1-3连接压电复合材料的无切口结构，其中电极由光刻法限定。为了实现这一点，复合材料不仅需要平面，平行和光滑的表面，而且还必须使用与光刻所需的化学品，热量和真空相容的环氧树脂填料。本文报道了适用于精细规模无切口阵列制造的环氧树脂的完整表征，包括光刻工艺。材料性能已被调查作为一个功能的固化温度和与溶剂的兼容性。通过提高固化温度，环氧树脂和硬化剂之间的交联增加，导致更高的玻璃化转变温度。固化的环氧树脂因此具有更好的耐热性和耐溶剂性。需要接近100°C的高固化温度来优化1-3压电复合材料上光刻的材料特性。对环氧树脂的声学性能也进行了研究。这些类似于压电复合材料制造中使用的其他环氧树脂，并且对于不同的固化温度没有观察到显著的变化。
Miniature ultrasound transducer arrays that can operate at frequencies above 30 MHz are needed for high-resolution medical imaging. One way to achieve this is with a kerfless structure based on 1-3 connectivity piezocomposite with the electrodes defined by photolithography. To achieve this, not only does the composite need planar, parallel, and smooth surfaces, but it must also be made with an epoxy filler compatible with the chemicals, heat, and vacuum required for photolithography. This paper reports full characterization of an epoxy suitable for fine-scale kerfless array fabrication, including photolithographic processing. Material properties have been investigated as a function of cure temperature and for compatibility with solvents. By increasing the cure temperature, the crosslinking between the epoxy and the hardener in- creases, resulting in a higher glass transition temperature. The cured epoxy consequently has better resistance to both heat and solvents. An elevated cure temperature, near 100°C, is required to optimize material properties for photolithography on 1-3 piezocomposites. The acoustic properties of the epoxy have also been studied. These are similar to other epoxies used in piezocomposite fabrication and no significant changes have been observed for the different cure temperatures.